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Rudolph Technologies Announces New Clearfind Technology for Advanced Packaging Inspection

July 11,2016 12:07

WILMINGTON, Mass.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented Clearfind™ technology, which can detect organic defects that are difficult or impossible to see with conventional white-light imaging ...and more »


WILMINGTON, Mass.--(BUSINESS WIRE)--Rudolph Technologies, Inc. (NYSE: RTEC) today unveiled its new patented
Clearfindâ„¢ technology, which can detect organic defects that are
difficult or impossible to see with conventional white-light imaging
techniques. Organic contaminants are often the root cause of field
failures, which occur after the material has been exposed to operating
conditions for extended periods. Rudolph has been actively collaborating
with several key customers to fully understand their inspection
challenges and how the new technology addresses them, and plans to
incorporate Clearfind technology in its upcoming defect inspection
systems for advanced packaging applications.

“As advanced packaging processes become more complex, process windows
are shrinking and manufacturers are seeking better methods for control
and inspection that balance the need for high throughput against the
‘escape’ of true defects and the ‘false positive’ detection of nuisance
defects,” said Mike Goodrich, vice president and general manager of
Rudolph’s Process Control Group. “Organic defects, in particular, have
become more troublesome as die interconnects shrink and there is less
surface area for good adhesion. Clearfind technology will help our
customers see these defects earlier in the process, permitting faster
action to mitigate the root cause and reducing the amount of product in
jeopardy.”

Goodrich continued, “Using laser illumination we are able to clearly
identify residue defects that typical white-light optics would miss. In
addition to optimizing the wavelength of the illumination to enhance
detection, we have specifically designed the mechanics of the system to
accommodate the high warpage found in advanced packaging applications.”

Clearfind technology highlights organic residues on bumps and bond pads
or at the bottoms of vias so that they are easy to detect. On metals, it
eliminates the high-contrast graininess seen under conventional
illumination, resulting in an obvious defect signal against a
featureless background. This same graininess in conventional imaging can
also cause false positives, which are especially costly at this stage of
the process where the sunk cost of unnecessarily rejected good product
is high. Finally, Clearfind technology readily detects shorts and opens
in metal lines when inspected with an underlying organic layer. Rudolph
believes these capabilities will significantly increase its customer’s
ability to detect process and manufacturing related issues earlier in
the process resulting in significant yield, which equates to millions of
dollars in savings, especially for processes utilizing known-good die.
Rudolph’s customers see this as a critical technology to improve quality
for their customers in order to avoid the high costs of replacement and
penalties.

For more information about the new Clearfind technology, please visit
Rudolph at SEMICON® West, booth 6543, in the North Hall, or
go to the Rudolph Technologies website: www.rudolphtech.com/clearfind.

About Rudolph TechnologiesRudolph Technologies, Inc. is a
leader in the design, development, manufacture and support of defect
inspection, lithography, process control metrology, and process control
software used by semiconductor and advanced packaging device
manufacturers worldwide. Rudolph delivers comprehensive solutions
throughout the fab with its families of proprietary products that
provide critical yield-enhancing information, enabling microelectronic
device manufacturers to drive down costs and time to market of their
devices. Headquartered in Wilmington, Massachusetts, Rudolph supports
its customers with a worldwide sales and service organization.
Additional information can be found on the Company’s website at www.rudolphtech.com.

Safe Harbor StatementThis press release contains
forward-looking statements within the meaning of the Private Securities
Litigation Reform Act of 1995 (the “Act”) which include the benefit to
customers of Rudolph’s products, Rudolph’s ability to successfully
innovate, develop new technologies and products and deliver products and
services consistent with our customers’ demands and expectations as well
as other matters that are not purely historical data. Rudolph wishes to
take advantage of the “safe harbor” provided for by the Act and cautions
that actual results may differ materially from those projected as a
result of various factors, including risks and uncertainties, many of
which are beyond Rudolph’s control. Such factors include, but are not
limited to, the company’s offered design enhancements may not
necessarily translate into significant revenue and the challenges
presented by the new product development and marketing. Additional
information and considerations regarding the risks faced by Rudolph are
available in Rudolph’s Form 10-K report for the year ended December 31,
2015 and other filings with the Securities and Exchange Commission. As
the forward-looking statements are based on Rudolph’s current
expectations, the company cannot guarantee any related future results,
levels of activity, performance or achievements. Rudolph does not assume
any obligation to update the forward-looking information contained in
this press release.

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