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Invensas and Jabil Collaborate to Qualify BVA® Technology for Future Products

July 11,2016 14:06

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation and Jabil (NYSE: JBL), one of the world's leading design and manufacturing product solution ...and more »

SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its
wholly owned subsidiary Invensas Corporation and Jabil (NYSE: JBL), one
of the world’s leading design and manufacturing product solution
providers, have completed the first phase of qualification of Invensas
Bond-Via-Array™ (BVA®) interconnect technology.

“BVA is a proven high density, 3D interconnect technology for
Package-on-Package (PoP) and System-in-Package (SiP) applications,” said
Craig Mitchell, president, Invensas. “As an established leader in the
manufacture of a diverse array of electronic products, Jabil’s
identification of BVA as the benchmark for fine pitch package stacking
is yet another validation of the value that this technology brings to
the industry.”

Jabil’s interest stems from a desire to address customer requirements to
mount fine pitch stacked packages to printed circuit boards (PCBs) with
high yield and high throughput. In order to optimize the PCB assembly
process of BVA-based packages for high volume production and ensure a
complete manufacturing ecosystem, Jabil will also collaborate with Fuji
Machine Mfg. Co., Ltd., a leading provider of surface mount technology
equipment. The two companies are well suited to make significant
contributions in the form of novel and proprietary PCB assembly

“Invensas BVA technology is a low-cost, versatile package stacking
solution that is capable of scaling to very fine pitch,” said Dan
Gamota, vice president of strategic capabilities, Jabil. “At Jabil, we
expect such innovative packaging solutions, and our ability to assemble
them to PCBs, will be required to address the demand for ever increasing
performance and functionality in future customer products. We look
forward to continuing to work with Invensas as we explore uses of this
important technology.”

Invensas BVA technology provides the industry with a scalable package
stacking platform that leverages existing manufacturing infrastructure
while delivering unmatched tolerance to process variations; this
translates into improved yield and cost efficiencies. The technology can
be used to provide cost effective 3D interconnect solutions for
Package-on-Package (PoP), System-in-Package (SiP) and a range of other
packaging applications. For more information on Invensas BVA technology
and other Invensas solutions, please visit www.invensas.com
or www.tessera.com.

About Tessera Technologies, Inc.

Tessera Technologies, Inc., including its Invensas and
FotoNation subsidiaries, licenses technologies and intellectual property
to customers for use in areas such as mobile computing and
communications, memory and data storage, and 3D-IC technologies, among
others. Our technologies include semiconductor packaging and
interconnect solutions, and computational imaging and computer vision
products and solutions for mobile and other vision systems. For more
information call +1.408.321.6000 or visit www.tessera.com or www.invensas.com.

Tessera, the Tessera logo, Invensas, the Invensas logo, Bond-Via-Array
and BVA, are trademarks or registered trademarks of affiliated companies
of Tessera Technologies, Inc. in the United States and other countries.
All other company, brand and product names may be trademarks or
registered trademarks of their respective companies.

About Jabil

Jabil is an electronic product solutions company providing comprehensive
electronics design, production and product management services to global
electronics and technology companies. Offering complete product supply
chain management from facilities in 28 countries, Jabil provides
comprehensive, individualized-focused solutions to customers in a broad
range of industries. Jabil common stock is traded on the New York Stock
Exchange under the symbol, “JBL”. For further information please visit, www.jabil.com/.

Safe Harbor Statement

This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
characteristics, benefits, and features of BVA and potential future uses
of such technology in future products. Material factors that may cause
results to differ from the statements made include the plans or
operations relating to the businesses of Tessera Technologies, Inc. (the
"Company"); market or industry conditions; changes in patent laws,
regulation or enforcement, or other factors that might affect the
Company's ability to protect or realize the value of its intellectual
property; the expiration of license agreements and the cessation of
related royalty income; the failure, inability or refusal of licensees
to pay royalties; initiation, delays, setbacks or losses relating to the
Company's intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; fluctuations in operating
results due to the timing of new license agreements and royalties, or
due to legal costs; the risk of a decline in demand for semiconductors
and products utilizing FotoNation technologies; failure by the industry
to use technologies covered by the Company's patents; the expiration of
the Company's patents; the Company's ability to successfully complete
and integrate acquisitions of businesses; the risk of loss of, or
decreases in production orders from, customers of acquired businesses;
financial and regulatory risks associated with the international nature
of the Company's businesses; failure of the Company's products to
achieve technological feasibility or profitability; failure to
successfully commercialize the Company's products; changes in demand for
the products of the Company's customers; limited opportunities to
license technologies due to high concentration in the markets for
semiconductors and related products and smartphone imaging; and the
impact of competing technologies on the demand for the Company's
technologies. You are cautioned not to place undue reliance on the
forward-looking statements, which speak only as of the date of this
release. The Company's filings with the Securities and Exchange
Commission, including its Annual Report on Form 10-K for the year
ended Dec. 31, 2015 and its Quarterly Report on Form 10-Q for the
quarter ended Mar. 31, 2016, include more information about factors that
could affect the Company's financial results. The Company assumes no
obligation to update information contained in this press release.
Although this release may remain available on the Company's website or
elsewhere, its continued availability does not indicate that the Company
is reaffirming or confirming any of the information contained herein.


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